SMD Assembly

Benefit from our many years of experience in SMD production

SMD components not only save space, but also costs thanks to fully automated production. This trend was recognized as early as 1992 when Schaffner GmbH was founded, which is why the company has continuously invested in know-how and equipment for production using SMD technology.

SMD production: Solder paste printing

As the first step in SMD assembly, the solder paste is applied using one of our 3 fully automatic paste printers. Solder paste printing in the form of solder paste deposits on printed circuit boards is an important and elementary component of modern SMT production technology. The solder paste consists of fine solder powder and viscous flux. In the solder paste printer, a squeegee moves over a stainless steel stencil, filling its openings. After the printing process, the exact amount of solder paste is applied to the component pads of the circuit board, which is fixed precisely under the stencil. Thanks to the know-how of Schaffner GmbH, we can set the course for a smooth production process with the design of the paste stencil even before production.

SMD production: Assembly

Schaffner has 6 modern placement machines with which we can precisely place the SMD components on the circuit boards. After picking the material and clamping the individual components in the feeders, the placement machines are precisely adjusted and calibrated to ensure high-precision placement.

SMD production: Soldering process

We have two different systems for the soldering process. Fast throughput can be guaranteed thanks to our reflow oven, where hot air is used to solder in different zones, similar to a hot air dryer. Schaffner GmbH processes very sensitive assemblies in the vapor phase oven, in which a gentle soldering process can be guaranteed by means of hot steam, similar to a steamer.

SMD production is one of Schaffner GmbH's greatest strengths

SMD production means 'surface-mounted device' and stands for the assembly of a printed circuit board using surface-mounted components. These elements are soldered directly onto a circuit board with solderable contact surfaces and not soldered into vias using wires as in through-hole assembly. At Schaffner GmbH, you will find six state-of-the-art pick-and-place machines that enable fast and flexible assembly of the components. In SMD production, a screen print is created in advance using an optically supported automatic printing machine. We use a reflow and condensation system for the subsequent soldering process.